Plasma-Enhanced Chemical Vapor Deposition (PECVD) is a widely used thin-film deposition technique in semiconductor manufacturing, optics, photovoltaics, and other advanced material applications. Compared to traditional Chemical Vapor Deposition (CVD), PECVD offers significant advantages, particularly in achieving high-quality films at lower temperatures.
Tag Archives: PECVD for Semiconductor Manufacturing
Chemical Vapor Deposition (CVD) technology is widely used in semiconductor manufacturing, optics, thin-film coatings, and material science. Within this technology, different types of CVD furnaces exist, including CVD, PECVD (Plasma-Enhanced CVD), and FBCVD (Fluidized Bed CVD).