Laboratory Vacuum Atmosphere Tube Furnace for Wafer Processing

This tube furnace is designed for sample preparation of various materials in a clean environment. The product uses a ring-shaped heating element outside the high-purity quartz vacuum chamber for uniform heating. It features high thermal efficiency, fast heating rates, and excellent temperature uniformity. The protective atmosphere circulates evenly inside, with forward and reverse flow, and high-temperature resistant seals are used at sealing points. The water-cooled stainless steel sealing system ensures safety and reliability.
The equipment is equipped with a complete automated touch-screen interface and includes over-temperature, thermocouple disconnection, and low water pressure alarm functions.

Send Inquiry Categories: 100-1200.C, Controlled Atmosphere Furnaces, Material Science, Semiconductor, Semiconductor R&D, Sintering, Solar Cell R&D, Tube Furnaces, Vacuum Furnace Tags: Custom Tube Furnace for Semiconductor Applications, High-Temperature Tube Furnace for Wafer Sintering, Laboratory Tube Furnace for Wafer Heat Treatment, Precision Tube Furnace for Wafer Sintering, Quartz Tube Furnace for Wafer Processing, Tube Furnace for High-Temperature Wafer Processing, Tube Furnace for Semiconductor Wafer Processing, Tube Furnace for Silicon Wafer Heat Treatment, Tube Furnace for Wafer Annealing, Tube Furnace for Wafer Coating, Tube Furnace for Wafer Doping and Diffusion, Vacuum Atmosphere Tube Furnace, Vacuum Tube Furnace, Wafer Processing Tube Furnace, Wafer Processing Tube Furnace for Cleanroom Applications

Description
SPECIFICATIONS

Laboratory Vacuum Atmosphere Tube Furnace for Wafer Processing

Introduction

This tube furnace for wafer processing is designed for sample preparation of various materials in a clean environment. The product uses a ring-shaped heating element outside the high-purity quartz vacuum chamber for uniform heating. It features high thermal efficiency, fast heating rates, and excellent temperature uniformity. The protective atmosphere circulates evenly inside, with forward and reverse flow, and high-temperature resistant seals are used at sealing points. The water-cooled stainless steel sealing system ensures safety and reliability.

The equipment is equipped with a complete automated touch-screen interface and includes over-temperature, thermocouple disconnection, and low water pressure alarm functions.

Tube Furnace for Wafer Processing (3)

Main Features

Large-diameter quartz vacuum chamber, capable of handling large-sized, thin sheet-like samples, with uniform heating from the ring-shaped heating element, ensuring excellent sintering results.
Embedded operating system with a bilingual (Chinese/English) graphical interface, featuring a 7-inch color touch screen for intuitive operation and real-time curve tracking.
Double-layer insulation structure with a wind-cooling interlayer.
High-purity Al2O3 fiber refractory insulation material for maximum energy saving.
High-purity alumina coating on the refractory furnace lining to extend service life.
High-purity quartz furnace plug helps establish custom temperature gradients inside the tube.
Complete over-temperature, thermocouple disconnection, and cooling water failure protection measures for safe operation.
Interchangeable temperature measurement hole and observation window (select one).

Technical Parameters

Model	VA1200-20
Power Supply	AC 220V 4KW
Max.temperature	1200.C(<1 hour)
Long-Term Operating Temperature Range	300~1150°C
Heating Rate	1°C/H-20°C/Min
Heating Zone Dimensions	Φ190mm *200mm(suitable for 6” wafer processing. Bigger size for 8” wafer processing, can be customized)
Chamber Divider	Double-lay(optional) Wafer quartz holder can be customized
Intelligent Touch Screen Control System	Control mode: Embedded operating system with graphical interface in both Chinese and English, 7-inch color touchscreen input, intelligent human-machine dialogue mode Temperature curve setting: can store up to 15 temperature curves, each curve can be set with 30 segments of “time-temperature curve,” real-time monitoring, dynamically displaying the “time-temperature curve” Temperature calibration: Non-linear correction of the temperature difference between the temperature control temperature and the sample temperature throughout the system Equipment operation time recording: Sintering data storage, automatic report generation, real-time recording and retrieval System protection: Over-temperature alarm, thermocouple disconnection, cooling water failure, open circuit prompt, etc.
Gas Supply System	Uses a float-type flowmeter to control the gas flow rate, integrated with the equipment. The unit has been leak-tested before leaving the factory. Mass flow controller is optional
Pressure Measurement and Monitoring	Uses a mechanical pressure gauge with a gas-tight structure to effectively protect internal components from environmental impact and debris, while offering strong resistance to corrosion and high temperatures.
Temperature Accuracy	±1°C
Heating Element	Ring-shaped heating element made of Mo-doped Fe-Cr-Al alloy, providing uniform and reliable temperature distribution.
Sealing System	Stainless steel sealing flange. Additionally equipped with an inlet, outlet, and vacuum interface. Vacuum: ≤10Pa (mechanical pump)
Dimensions	780580600mm (WHD)
Net Weight	60KG
Service Support	Two-year limited warranty with lifetime support (Warranty excludes consumable parts such as quartz chamber and O-rings).

Precautions for Equipment Use

1.The gas cylinder has a high internal pressure. When introducing gas into the furnace tube, a pressure reducing valve must be installed on the cylinder. It is recommended to select a small pressure reducing valve for experimental use, with a pressure range of 0.01MPa-0.15MPa, ensuring more accurate and safe operation.

2.When using this equipment for high-temperature sintering, a water chiller must be connected to the system to prevent the high-temperature sealing silicone rings from melting during operation.