Chemical Vapor Deposition (CVD) System

Chemical Vapor Deposition (CVD) System

Introduction:

Chemical Vapor Deposition (CVD) refers to a method where chemical gases or vapors react on the surface of a substrate to synthesize coatings or nanomaterials. It is a widely used technology in the semiconductor industry for depositing thin film materials, including a broad range of insulating materials, as well as most metal and metal alloy materials. In response, we have developed a comprehensive CVD coating system suitable for major university materials laboratories, research institutes, and fields such as environmental science.

Features:

1.Utilizing high-purity quartz furnace tube with excellent corrosion resistance and high-temperature performance.
2.High-purity Al2O3 fiber refractory insulation material, providing superior insulation and reducing equipment power consumption.
3.The furnace body employs a double-layer air-cooling structural design.
4.Sintering process curve settings: Dynamically display and set curves, allowing the pre-storage of multiple sintering processes. Each process curve can be freely configured. 7” colored graphic touch panel, more intuitive and convenient operation.
5.Scheduled sintering allows for unmanned operation, implementing scheduled sintering process curves.
6.Real-time display of sintering power, voltage, and other information, recording sintering data, and enabling paperless documentation export.
7.Capable of remote control to observe equipment status in real-time.(Optional)
8.Temperature calibration: Non-linear correction is conducted throughout the entire sintering process based on the temperature difference between the main control temperature and sample temperature.
9.The integrated equipment includes a multi-channel gas supply system, heating system, and vacuum system.

Technical Parameters:

Model	O1200-XTI（Tube diameter : 50/60/80/100mm Optional）
Working temperature	≤1150℃
Heating length	440mm
Heating rate	≤20℃/min
Power supply	AC 220V  4KW
Gas supply system（Optional）	Flowmeter type	Float flow meter				Mass Flow Controller (MFC)
	Piping Diagram
	Quantity of Inlet ports	2、3、4（Multiple Options Available）
	Flow Range	20-250/20-800ml/min ( Multiple range optional)				50/100/200/500sccm ( Multiple range optional)
	Operating Pressure Differential Range	0-0.15MPa
Low Vacuum System（Optional）	Vacuum model		1.5C		3C		4C
	Pumping rate		1L/s		3L/s		4L/s
	Inlet and Outlet Port Dimensions		8mm Pagoda Joint		8mm Pagoda Joint		KF16/25
	Ultimate Vacuum Level		1000Pa		100Pa		10Pa
	Operating Environment Temperature		5-40℃
	Power supply		AC220V
High Vacuum System（Optional）	Vacuum model		103(A)		103(B)		103(C)
	Pumping rate		110L/s		600L/s		700L/s
	Vacuum Gauge		Compound Vacuum Gauge
	Ultimate Pressure		10^-3Pa		10^-4Pa		10^-5Pa
	Working Environment Temperature			5-40℃
	Power supply			AC 220V	AC 220V			AC 380V

Applications:

Chemical Vapor Deposition (CVD) systems have a wide range of applications across various industries due to their ability to deposit thin films and coatings with precise control. Here are some common applications of CVD systems:
Semiconductor Industry;
Optoelectronics;
Materials Science;
Microelectronics and Nanotechnology;
Coating Technology;
Photovoltaics;
Aerospace and Defense;
Medical Devices;
Energy Storage;
Research and Development;
Chemical and Biological Sensors;
Glass Coating;
Automotive Industry;
Tool and Cutting Industry;
Display Technology, etc.