Large-Size Tubular Furnace 1200℃ Wafer Annealing Furnace
Introduction
The large-size wafer annealing furnace is specially developed and manufactured for large workpieces or batch heat treatment production. It is primarily used in industries such as semiconductor wafer annealing, LED phosphor, substrate materials, battery materials production, and more. The furnace tube is made of large-diameter high-purity quartz material, which can be used for both atmosphere processing and vacuum applications. It adopts intelligent PID fuzzy control and multi-point temperature measurement to ensure uniform temperature distribution inside the furnace.
Features of Wafer Annealing Furnace
- Extra-large tube diameter, long heating zone, multi-point temperature control ensures uniform temperature distribution.
- High-purity Al2O3 fiber refractory insulation material, providing excellent thermal insulation, significantly reducing the power consumption of the equipment.
- The furnace body adopts a double-layer air-cooling structure to effectively lower the surface temperature of the furnace shell.
- Equipped with a constant pressure system that automatically adjusts the internal pressure of the furnace tube.
- Quick-opening stainless steel sealing flanges for easy loading and unloading of materials.
Technical Specifications of Wafer Annealing Furnace
Model | T1200-152T2 | T1200-152T3 | T1200-215T3 |
Power Supply | AC380V 10KW | AC380V 15KW | AC380V 24KW |
Max.temp | 1200 ℃ (<1hour) | ||
Working temp | 1100 ℃ (Continuous) | ||
Heating Rate | ≤ 20°C/min | ||
Heating Zone Length | 600mm | 1100mm | 1100mm |
Furnace Tube Size | Φ152*1200mm | Φ152*1650mm | Φ215*1660mm |
Intelligent Touch Screen Control System | 1. Embedded system with a bilingual (Chinese/English) graphical interface, 7-inch color touch screen input, intelligent human-machine interaction mode, non-linear temperature correction.
2. More intuitive experimental process, easier operation. 3. Features over-temperature alarm, thermocouple disconnection alert, and leakage protection. |
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Temperature Accuracy | +/- 1 ℃ | ||
Heating Element | Mo-doped Fe-Cr-Al Alloy | ||
Sealing System
Quick-opening stainless steel sealing flanges |
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Vacuum: ≤10Pa (Mechanical Pump) | |||
Pressure Measurement and Monitoring | Intelligent digital pressure gauge for precise pressure display and adjustable pressure settings. It works with a high-precision, high-stability solenoid valve to maintain stable internal furnace tube pressure. Additionally, the device is equipped with a backup pressure protection system for enhanced safety and reliability. | ||
Gas Supply System | Floater flow meter to control gas flow rate, integrated with the equipment. Leakage testing is performed before delivery | ||
Net Weight | 85KG | 105KG | 215KG |
Service Support | 1-year warranty with lifetime support (does not cover consumables such as furnace tubes and seals). |
Precautions for Use
- When using the equipment, the internal pressure of the furnace tube must not exceed 0.125MPa (absolute pressure) to prevent equipment damage.
- Gas cylinders have high internal pressure. When feeding gas into the furnace tube, a pressure-reducing valve must be installed on the gas cylinder. It is recommended to select a small pressure-reducing valve with a range of 0.01MPa-0.15MPa for more accurate and safer operation.
- When the furnace temperature exceeds 1000°C, the furnace tube should not be under vacuum. The internal pressure of the furnace tube should be at atmospheric pressure.
- During heating experiments, it is not recommended to close the gas inlet and outlet valves at the furnace tube flanged ends. If gas valves must be closed during sample heating, constantly monitor the pressure gauge reading. The absolute pressure gauge reading should not exceed 0.15MPa.
Which kinds of industry can use this furnace?
College & Universities, Institute, enterprise, Chemistry, Electronics,etc
For research and manufacture of semiconductor, LED phosphors, substrate materials, and battery materials, etc
Applications
The large-size wafer annealing furnace is specially developed and manufactured for large workpieces or batch heat treatment production. It is primarily used in industries such as semiconductor wafer annealing, LED phosphor, substrate materials, battery materials production, and more.